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Dense Array

Ultra-high-density test chip with ultra-fast wafer-level measurement technology

Dense Array

Dense Array is a layout automation software for designing and fast testing ultra-high density test chips. Dense Array test chips can accommodate one million devices under test (DUT) within 10mm2 area, i.e. average 10um2/DUT. Fast testing of 10,000 samples per second is achieved by co-optimization between on-chip control module and test equipment. Besides, parallel testing can be also used, linearly accelerate the testing speed.

Main Features

Support outlier detection of multiple failure modes
Accurate failure analysis and positioning of outliers
Support IP customization + flexible design of the DUT
Support automatic layout design test chip layout
Support DRC/LVS automatic verification
Support different DUT types, e.g. logic, memory, etc.
Automatic document generation for layout and test
Silicon verified in a wide range of multiple technology nodes

Applications

Dense Array has been widely used in multiple process nodes.

By using Dense Array solution, our customer has already successfully placed 30 millions DUTs in a single wafer, and has measured 1 million measurements in less than 1 minute. The large sample size and fast test speed successfully accelerated the process development.

Dense Array can place 30 million DUTs with a single wafer, and takes 1 minute to measure 1 million measurements. While addressable solution takes about 100 wafers to place 30 million DUTs, and takes about 1 hour to measure 1 million measurements. Dense Array achieves nearly 100 times higher DUT density and test speed.

Dense Array has helped the customer successfully find numerous failure modes that were not detected by the previous solution, and effectively shorten the development cycle.